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this is information on a product in full production. april 2012 doc id 15035 rev 3 1/12 12 emif02-spk02f2 2-line ipad?, emi filter and esd protection datasheet ? production data features packaged in lead-free flip chip very low resistance: 0.35 high attenuation: -45 db at 900 mhz very low pcb space consumption: 0.89 mm x 1.26 mm very thin package: 0.65 mm high efficiency in esd suppression iec6 1000-4-2 level 4 high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) application mobile phones description the emif02-spk02f2 chip is a highly integrated device designed to suppress emi/rfi noise for interface line filtering. the emif02-spk02f2 flip-chip packaging means the package size is equal to the die size. that's why the emif02-spk02f2 is a very small device. additionally, this filter includes esd protection circuitry, which prevents damage to the protected device when subjected to esd surges up 30 kv. figure 1. pin configuration (bump side) figure 2. functional schematic tm : ipad is a trademark of stmicroelectronics flip-chip package (5 bumps) 3 o1 o2 gnd i2 i1 2 a b c 1 input output input output www.st.com
characteristics emif02-spk02f2 2/12 doc id 15035 rev 3 1 characteristics figure 3. electrical char acteristics - definitions table 2. electrical characteristics - values (t amb = 25 c) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2 air discharge contact discharge 30 30 kv i spk maximum rms current per channel 350 ma t j junction temperature range -30 to 125 c t stg storage temperature range -55 to + 150 c symbol test conditions min typ max unit v br i r = 1 ma 6 v i rm v rm = 3 v 400 na r i/o 0.35 0.8 c line v r = 0 v dc, 1 mhz 185 250 315 pf f c cut-off frequency: z source = z load = 50 20 mhz symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop r br rm rm rm pp r f v = clamping voltage cl f d = dynamic resistance t = voltage temperature i i pp pp v v cl cl slope: 1/r d slope: 1/r d
emif02-spk02f2 characteristics doc id 15035 rev 3 3/12 figure 4. attenuation measurements versus frequency figure 5. crosstalk measurements versus frequency 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -40.00 -30.00 -20.00 -10.00 0.00 i1-o1 i2-o2 f (hz) s21 (db) 100.0k 1.0m 10.0m 100.0m 1.0g -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 i1-o2 f (hz) xtalk (db)
characteristics emif02-spk02f2 4/12 doc id 15035 rev 3 figure 6. esd test conditions figure 7. clamping voltage v cl versus peak pulse current i pp for short pulse duration such as esd surges note: for further information on the dynamic characteristic see the stmicroelectronics? application note an4022, ?tvs short pulse r d measurement and correlation with tvs clamping voltage during esd?. 2 x -20 db 50 input i pp (a) 0 5 10 15 20 25 30 35 40 0246810121416 i p p ( a ) v cl (v) t j initial = 25 c t p = 100 ns typical breakdown dynamic resistance r d : 140 m v cl (v)
emif02-spk02f2 characteristics doc id 15035 rev 3 5/12 figure 8. output filter esd response to iec 61000-4-2 (+8 kv contact discharge) i1 to o1 figure 9. output filter esd response to iec 61000-4-2 (-8 kv contact discharge) i1 to o1 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4 15.7 v 9.1 v 8.7 v 7.9 v 1 2 4 3 16.1 v -8.9 v -8.7v -7.9 v 1 2 4 3 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4
characteristics emif02-spk02f2 6/12 doc id 15035 rev 3 figure 10. output filter esd response to iec 61000-4-2 (+15 kv contact discharge) i1 to o1 figure 11. output filter esd response to iec 61000-4-2 (-15 kv contact discharge) i1 to o1 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4 25.5 v 9.7 v 10 v 8.3 v 1 2 4 3 23.8 v -10.2 v -8.3v -8.2 v 1 2 4 3 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4
emif02-spk02f2 characteristics doc id 15035 rev 3 7/12 figure 12. output filter esd response to iec 61000-4-2 (+30 kv contact discharge) i1 to o1 figure 13. output filter esd response to iec 61000-4-2 (-30 kv contact discharge) i1 to o1 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4 37.1 v 11.8 v 10.8 v 8.8 v 1 2 4 3 -37.9 v -12.2 v -11.3 v -8.4 v 1 2 4 3 v : esd peak voltage v :clamping voltage @ 30 ns v :clamping voltage @ 60 ns pp cl cl v :clamping voltage @ 100 ns cl 1 2 3 4
ordering information scheme emif02-spk02f2 8/12 doc id 15035 rev 3 2 ordering information scheme figure 14. ordering information scheme emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10(pf) or 3 letters = application 2 digits = version f = flip chip x = 2: lead-free, pitch = 500 m, bump = 315 m
emif02-spk02f2 package information doc id 15035 rev 3 9/12 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 15. package dimensions figure 16. footprint figure 17. marking 0.89 mm 50 m 1.26 mm 50 m 435 m 315 m 50 500 m 10 250 m 10 650 m 65 500 m 15 copper pad diameter: 250 m recommended, 300 m max. solder stencil opening: 330 m recommended solder mask opening recommendation: 340 m min. for 315 m copper pad diameter e x y x w z w dot, st logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
package information emif02-spk02f2 10/12 doc id 15035 rev 3 figure 18. flip chip tape and reel specification note: more information is availa ble in the application notes: an1235: ?flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 0.1 8 0.3 4 0.1 1.75 0.1 3.5 0.1 ? 1.5 0.1 0.73 0.05 xxz yww e st xxz yww e st xxz yww e st
emif02-spk02f2 ordering information doc id 15035 rev 3 11/12 4 ordering information 5 revision history table 3. ordering information order code marking package weight base qty delivery mode emif02-spk02f2 jd flip chip 1.8 mg 5000 tape and reel 7? table 4. document revision history date revision changes 17-sep-2008 1 initial release. 12-sep-2011 2 updated figure 15 and figure 16. 3-apr-2012 3 updated cover page features and description.inserted figure 6 to figure 13 .
emif02-spk02f2 12/12 doc id 15035 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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